JPH0354469B2 - - Google Patents
Info
- Publication number
- JPH0354469B2 JPH0354469B2 JP3744482A JP3744482A JPH0354469B2 JP H0354469 B2 JPH0354469 B2 JP H0354469B2 JP 3744482 A JP3744482 A JP 3744482A JP 3744482 A JP3744482 A JP 3744482A JP H0354469 B2 JPH0354469 B2 JP H0354469B2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- substrate
- packing material
- fixing piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3744482A JPS58154250A (ja) | 1982-03-09 | 1982-03-09 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3744482A JPS58154250A (ja) | 1982-03-09 | 1982-03-09 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58154250A JPS58154250A (ja) | 1983-09-13 |
| JPH0354469B2 true JPH0354469B2 (en]) | 1991-08-20 |
Family
ID=12497670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3744482A Granted JPS58154250A (ja) | 1982-03-09 | 1982-03-09 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58154250A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4898330B2 (ja) * | 2006-07-14 | 2012-03-14 | 三菱重工印刷紙工機械株式会社 | ウェブ折り畳み装置及び輪転印刷機 |
| FR2957192B1 (fr) * | 2010-03-03 | 2013-10-25 | Hispano Suiza Sa | Module electronique de puissance pour un actionneur pour aeronef |
| CN102915976B (zh) * | 2012-10-08 | 2015-07-29 | 华东光电集成器件研究所 | 一种耐高过载的集成电路 |
-
1982
- 1982-03-09 JP JP3744482A patent/JPS58154250A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58154250A (ja) | 1983-09-13 |
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